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April 2007

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Tue, 17 Apr 2007 08:51:26 +0200
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David,

Are you aiming at loctiting to fix corners during wave soldering? If you have that kind of corner problem, you seem to have a coplanarity issue. To fix that with a epoxy dot does not seem to be the best way. I would rather go to the BGA manufacturer and ask for good packages. Another problem, that occurs up and then, is bad corner ball wetting or even corner ball disrupts. I doubt such anomalies can be treated by means of epoxy dots. Agree with John Burke, we need know little more about your 'mechanical stress'.

Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: den 16 april 2007 23:56
To: [log in to unmask]
Subject: [TN] Tacking corners of BGAs

Dear Technetters,

 

We have a quality issue where some of our boards are returning because the BGAs need to be protected against mechanical stress.  We were considering using Loctite´s Chipbonder 348 on the corner of the BGAs in question (we would not to use an underfill).

 

Does anyone have any experience with Chipbonder 348 in this kind of application?

 

Would anyone care to suggest a heat-cured adhesive for tacking down corners of BGAs?

 

 

Thank you in advance,

 

David

[log in to unmask]


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