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April 2007

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Tue, 17 Apr 2007 08:18:47 +0200
Content-Type:
text/plain
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text/plain (69 lines)
Unparalleled, irresistible, mischiefable.... 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: den 16 april 2007 19:12
To: [log in to unmask]
Subject: Re: [TN] Placement of large flatpacks and BGAs close to board
edge

As a rule, I never place my thumbs where they can be hit with a hammer.
That's a technical dropping.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Monday, April 16, 2007 9:54 AM
To: [log in to unmask]
Subject: [TN] Placement of large flatpacks and BGAs close to board edge

Dear collegues,

I have heard of a thumb rule, never place them along and close to the
edge. Hence, we place them (when suitable) in the center. I have
forgotten why this rule. Was it because of vibration nodes, warpage
during soldering, tempcycle issues or what? Is there a IPC standard or
other reference?

Inge

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847-615-7100 ext.2815
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