Inge,
This is because board flexure or deformation is typically greatest at
corners and along board edges. The same rule should be applied to chip
capacitors as well.
Regards,
John Maxwell
>Dear collegues,
>
>I have heard of a thumb rule, never place them along and close to the
>edge. Hence, we place them (when suitable) in the center. I have
>forgotten why this rule. Was it because of vibration nodes, warpage
>during soldering, tempcycle issues or what? Is there a IPC standard or
>other reference?
>
>Inge
>
>
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------