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April 2007

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Mon, 16 Apr 2007 13:33:30 -0400
Content-Type:
text/plain
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text/plain (60 lines)
	So the answer is towards the edges, in a square board or the
ends, in the case of a rectangular board.  It also has to have a space
from the edge so that it is not bumped. 
	Ramon


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
Sent: Monday, April 16, 2007 1:19 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] Placement of large flatpacks and BGAs close
to board edge

There's an interesting article that sort of talks to your question in
Fridays SMT.

http://urltea.com/5vu 

KennyB

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Hfjord
Sent: Monday, April 16, 2007 12:54 PM
To: [log in to unmask]
Subject: [TN] Placement of large flatpacks and BGAs close to board edge


Dear collegues,

I have heard of a thumb rule, never place them along and close to the
edge. Hence, we place them (when suitable) in the center. I have
forgotten why this rule. Was it because of vibration nodes, warpage
during soldering, tempcycle issues or what? Is there a IPC standard or
other reference?

Inge

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