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April 2007

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Marsico, James
Date:
Mon, 16 Apr 2007 13:29:35 -0400
Content-Type:
text/plain
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text/plain (54 lines)
We place large components near the edges, since this is closest to our
rails for heat dissipation, and also the edges are least deflected
during vibration.

Jim Marsico
EDO Corporation
1250 New Horizons Blvd.
North Amityville, NY 11701
631-630-5079
[log in to unmask]
 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Monday, April 16, 2007 12:54 PM
To: [log in to unmask]
Subject: [TN] Placement of large flatpacks and BGAs close to board edge

Dear collegues,

I have heard of a thumb rule, never place them along and close to the
edge. Hence, we place them (when suitable) in the center. I have
forgotten why this rule. Was it because of vibration nodes, warpage
during soldering, tempcycle issues or what? Is there a IPC standard or
other reference?

Inge

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