Zlatko
Please contact Tom Newton at the IPC.
Best reguards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: "ZLATKO BIJEDIC" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, April 13, 2007 6:06 PM
Subject: Re: [TN] Via hole plating corner crack
> Hi Mr. Parker:
>
> Could you please give me direction how I can get your paper you presented
> at APEX.
> Regards
>
>
> ----- Original Message ----
> From: Lee parker <[log in to unmask]>
> To: [log in to unmask]
> Sent: Wednesday, April 11, 2007 12:41:40 PM
> Subject: Re: [TN] Via hole plating corner crack
>
>
> Victor
>
> You mentioned that the current density is 30 amps per square foot. I
> consider this to be extremely high and not only will cause brittle copper,
> but highly non-uniform copper in the barrel. I presented a paper at Apex
> that mathematically modeled the copper uniformity in the barrel to the
> plating parameters including current density, you might want to review
> this
> paper. The model shows there is an inverse linear dependence between the
> copper uniformity and the plating density.
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
> ----- Original Message -----
> From: "Victor G. Hernandez" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, April 10, 2007 10:36 AM
> Subject: Re: [TN] Via hole plating corner crack
>
>
> Can you please post the crack via cross section photo for viewing, "a
> picture is worth one thousands words". Is this SnPb or LF?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of C J Long
> Sent: Tuesday, April 10, 2007 9:20 AM
> To: [log in to unmask]
> Subject: [TN] Via hole plating corner crack
>
> Dear Techneter:
>
> I recently experienced customer return of corner crack. The PCB is 50
> mil
> thick, 10 mil via, OSP finish and corner crack is over the 4 corners of
> top
> and bottom
> of hole. Crack is started from the bottom of external foil and crack
> through
>
> the entire plating. You can see the photo (file: crack through) of
> actual
> failure. Plating is unusual column type crystal on the surface. In the
> hole
> barrel, the plating crystal is regular. We also performed many in-procss
> WIP
>
> cross section (refer to the file "crack 9X IR") and we could only find
> the
> crack after 6X IR reflow and its crack is started from external foil top
> corner. I have sucessfuly duplicated similar failire with very high
> plating
> current density of 30ASF with very low brighter (0.15cc/l), but its
> failure
> mode is crack on ehe top of external foil not the same as customer
> return.
> My questions are:
>
> 1. Are these two failre modes with the same root cause? What is the
> reason
> one crack is started from the foil top corner and the other is from the
> bottom?
> 2.Is there any non-destructive method able screening the cracked
> plating?
>
>
> http://tw.pg.photos.yahoo.com/ph/minalong2003/album?.dir=/5c32scd
>
> Thank you very much.
>
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