I do a lot of via in pad with the via half in a half out of
a given pad.

The via is covered by soldermask up to the pad which
has soldermask 3 mils over the pad. Therefore, the pad
geometry is changed very little.

Hope this helps.

Dave Seymour


[log in to unmask] wrote:

>Does anybody out there know where I can find a specification on whether a 
>filled via (overplated) that is half in and half out a smt pad is an 
>acceptable design practice?
>
>See attached picture:
> 
>Henry J. Rekers B. Eng
>Senior Manufacturing Engineer
>Power Monitoring and Control
> 
>Schneider Electric
>2195 Keating Cross Road,
>Saanichton, BC, V8M 2A5
>Tel: 1-(250) 652-7100 ext. 7510
>Fax: 1-(250) 544-2390
> 
>http://www.schneider-electric.com/
>Building A New Electric World(tm)
>
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-- 
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

[log in to unmask]

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