TECHNET Archives

April 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 13 Apr 2007 14:26:13 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Does anybody out there know where I can find a specification on whether a 
filled via (overplated) that is half in and half out a smt pad is an 
acceptable design practice?

See attached picture:
 
Henry J. Rekers B. Eng
Senior Manufacturing Engineer
Power Monitoring and Control
 
Schneider Electric
2195 Keating Cross Road,
Saanichton, BC, V8M 2A5
Tel: 1-(250) 652-7100 ext. 7510
Fax: 1-(250) 544-2390
 
http://www.schneider-electric.com/
Building A New Electric World(tm)

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2