LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

April 2007

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET April 2007

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Reference needed
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Thu, 5 Apr 2007 16:29:13 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (26 lines)

Hi 'Netters,
Can anybody send me a good copy [patrticularly Fig. 10] of Yoon, S., et al, 
(Hyundai) “CSP Board Level Reliability Testing of Pb-Free Sn-Ag-X (X=Cu, In) 
and Polymer-Core Solder Ball,” Proc. 6th Annual Pan Pacific Microelectronics 
Symp., Kauai, Hawaii, February 2001?



Werner




**************************************
 See what's free at http://www.aol.com.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG