Ni/Pd/Au makes relatively weak solder joint with Sn/Pb eutectic solder.
This is caused by the incompatibility of Pd with the Pb component of the
solder.
Pd and Pb do not form an intermetallic.
The good news is Ni/Pd/Au makes a very robust solder joint with SAC alloy or
lead free solder.
The details were published in the Apex proceedings of 2006.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
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Cell: (516) 901 3874
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