Robert,

We have assembled some boards with SnNipdAu component. The component was a
QFP. We had heavy solderability issues on the reflow.The joint takes a bump
formation. Hand soldering was not an issue. I have infact posted the same
query last week in technet and the response was minimal.


Thanx
Badri



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Thursday, April 05, 2007 3:02 AM
To: [log in to unmask]
Subject: [TN] NiPdAu FINISH

Has anyone had an issue with TSSOP-xx pin packages (with NiPdAu lead
finish) in the ability to solder using a normal SnPb solder both for SMT
reflow and/or hand solder?  Thanks in advance, Jon 

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