Hi Jon - I always chuckle as the Pbfree soldering advances throughout the
industry raising questions. Your question is a case in point (good
question, just somewhat ironic). Texas Instruments introduced the industry
to their NiPdAu component surface finish approximately in 1990 timeframe.
Its a safe bet to say that if you have been soldering Texas Instruments
leaded surface mount components (QFPs, SOICs, etc.) during the last 10
years, that you have most likely been soldering to a NiPdAu surface finish.
The NiPdAu finish has two issues to understand: (1) this surface finish can
be flux sensitive - i.e. some fluxes work better than others; (2) this
finish is a bit slower to "wet" than a tin/lead surface finish because of
the Pd layer. You may need to either/or increase your reflow temperatures a
bit (approximately 5-10 degrees) or slow down your conveyor speed slightly
to allow for wetting to take place. Good Luck.

Dave Hillman
Rockwell Collins
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             <JRoberts@DRS-TEM                                             
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             <JRoberts@DRS-TEM                                             
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Has anyone had an issue with TSSOP-xx pin packages (with NiPdAu lead
finish) in the ability to solder using a normal SnPb solder both for SMT
reflow and/or hand solder?  Thanks in advance, Jon

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