TECHNET Archives

April 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Mon, 30 Apr 2007 12:01:38 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines)
Hi Ioan,

You may need to put that out to a wider audience - leadfree on IPC?

The science behind the SN100C is spot on and faced with a choice between it
and SAC 305 I would choose it because of the reduction in copper scavenging
which by the way is very real.

You need to get an input from Werner on this.

John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Monday, April 30, 2007 11:42 AM
To: [log in to unmask]
Subject: [TN] SN100C vs. SAC305

Dear Technos,

I need to know how is this combat evolving. This topic has been brought up
several times, but things change fast right now and there must be more
empirical data on the matter.

What I know regarding the 2 materials can be summarized:

*	Pro SN100C: cheaper, better looking, eats less copper in the TH
*	One major unknown - the Reliability: SN100C is not available in
solder paste format, therefore the boards would have SAC SMT joints and
SN100C TH joints. This means 2 different materials and since we don't know
how reliable a board with only one material is, should we risk introducing
an extra variable?

I would like to know what your take is. Does anybody mixes the 2 materials?
Any reliability testing done? How long have you been doing it and do you see
RMAs?

Thanks,

Ioan


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2