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April 2007

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Subject:
From:
Ron Peeler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ron Peeler <[log in to unmask]>
Date:
Thu, 26 Apr 2007 08:37:46 -0400
Content-Type:
text/plain
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text/plain (206 lines)
Bev,

You are completely right.  This product that I have been "baptized" into has
been a 4 year terror.  I am probably the 8th set of eyes to look at it.  I
have seemed to make the most progress but that doesn't mean a thing.  All I
do know is that the design is not good, the parts are obsolete and the board
is already being produced in a new generation build, so basically I am stuck
with what I have.  Even though scrap is high on this board, they just want
to pump them out till they fizzle out.  So I am stuck with trying to find a
reliable way to solder these BGA's when in 4 years they haven't been able to
on this board.  I know that the warping on the board is causing the issue in
conjunction with the uneveness of the BGA package, neither of which can be
changed. 

Ronald D. Peeler Jr., B.S. IE 
Process Engineer 
SWEMCO 
Moorestown, NJ 08057 
Tel: (856).222.9900 ext. 31 
Cel: (484).948.0779 
Fax: (856).222.0700 
[log in to unmask]



-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, April 25, 2007 4:58 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights


Ron,
The problem right now is you see an effect and you do not know the
cause.  It could be that the board and/or component warps and you have
opens. It could be that you have a head-in-pillow situation.  It could
be that you have internal component opens.  It could be that you have
cracked solder joints.  You have to figure out which it is before you
try to apply a remedy.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ron Peeler
Sent: Wednesday, April 25, 2007 4:38 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights

Don't try me I just might ask you that...

:)

Ronald D. Peeler Jr., B.S. IE 
Process Engineer 
SWEMCO 
Moorestown, NJ 08057 
Tel: (856).222.9900 ext. 31 
Cel: (484).948.0779 
Fax: (856).222.0700 
[log in to unmask]



-----Original Message-----
From: Wayne Thayer [mailto:[log in to unmask]]
Sent: Wednesday, April 25, 2007 4:35 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights


Hi Ron!

I think most people solve this problem by making sure the board and BGA
are planar during the process, and that the solder paste is thick enough
to make up the difference.  Then you have the "collapse" process working
for you too.

Weights can be used but are painful--last resort.  They absorb heat,
messing up the solder profile, and need to be fixtured so they don't
fall off during reflow.

Next you are likely to ask for a rule of thumb for the pressure
supportable by the solder surface tension and the compression of the
solder balls which ensues.  I don't know that--I just try weights until
it works.

Wayne Thayer

>>> [log in to unmask] 4/25/2007 4:23:12 pm >>>
Hello TechNet

I was wondering is there anything in the industry that is used to
weigh
BGA's down?  We are having an issue @ our shop with BGA's not
soldering
effectively to one of our boards.  Currently we have a board that is
suppose
to go through a boot process, however it has problems doing so.  The
issue
is resolved when you press down in the middle of the BGA and fails
again
once the BGA is released.  It doesn't help that our board warps easily
as
well.  Is there anything, small gram weights or so that can weigh down
a BGA
without shorting it?

Thanks

Ronald D. Peeler Jr., B.S. IE 
Process Engineer 
SWEMCO 
Moorestown, NJ 08057 
Tel: (856).222.9900 ext. 31 
Cel: (484).948.0779 
Fax: (856).222.0700 
[log in to unmask] 

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