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April 2007

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Subject:
From:
Kerry McMullen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 19 Apr 2007 14:28:50 -0400
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Like a Swiss Watch????



Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
825 University Avenue
Norwood, MA 02062-2643
(T) 781-467-5468
(C) 508-631-1832
(F) 781-461-0993



Joe Fjelstad <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/19/2007 02:19 PM
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] Fragility of Pb-free Solder Joints






 
This just came in my email from SMT Net. I have not been able to link to
the
article yet but the title and first paragraph sounds familiar.
Joe
_Fragility of Pb-free Solder Joints_
(http://www.smtnet.com/adsystem/redir.cfm?adid=831)
_Universal Instruments_
(
http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=46383
)
Credit/Source: Peter Borgesen, Surface Mount Laboratory, Universal
Instruments; and Donald W. Henderson, IBM Corporation
Recent investigations have revealed that Pb-free solder joints may be
fragile, prone to premature interfacial failure particularly under shock
loading,
as initially formed or tend to become so under moderate thermal aging.
Depending on the solder pad surface finish, different mechanisms are
clearly
involved, but none of the commonly used surface finishes appear to be
consistently
immune to embrittlement processes. This is of obvious concern for
products
facing relatively high operating temperatures for protracted times and/or

mechanical shock or strong vibrations in service...



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