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April 2007

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Subject:
From:
David Tremmel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Tremmel <[log in to unmask]>
Date:
Mon, 16 Apr 2007 16:55:47 -0500
Content-Type:
text/plain
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text/plain (42 lines)
Dear Technetters,

 

We have a quality issue where some of our boards are returning because the
BGAs need to be protected against mechanical stress.  We were considering
using Loctite´s Chipbonder 348 on the corner of the BGAs in question (we
would not to use an underfill).

 

Does anyone have any experience with Chipbonder 348 in this kind of
application?

 

Would anyone care to suggest a heat-cured adhesive for tacking down corners
of BGAs?

 

 

Thank you in advance,

 

David

[log in to unmask]


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