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April 2007

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Wed, 11 Apr 2007 10:09:12 +0300
Content-Type:
text/plain
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text/plain (65 lines)
Hi Al,

Is it wave soldering / manual soldering pads? Of through holes
components? 

If yes, you should control the Alloy of the solder and the pre heating
and soldering temperature.

If it SMT components in reflow soldering, I do not have record of such
failure.

Reuven


e mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of al shirazi
Sent: Tuesday, April 10, 2007 7:56 PM
To: [log in to unmask]
Subject: [TN] pad lifting

Dear Techneter:

I recently experienced some failures and trying to understand why?
  For SAC solder joints the pad lifting / Cratering happens to PCB
beneath the pad. 
  Can anyone think ways to prevent such failure from happening. 
   
  Thanks,
  Al

       
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