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April 2007

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TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Tue, 10 Apr 2007 14:29:08 +0200
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TechNet E-Mail Forum <[log in to unmask]>, "Preuschl, Thomas" <[log in to unmask]>
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"Preuschl, Thomas" <[log in to unmask]>
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Could you also send me this info, please
Tom 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Saturday, April 07, 2007 4:28 PM
To: [log in to unmask]
Subject: [TN] SV: [TN] Thermal via's on D2PAK

Ken,
If you need get rid of a lot of heat, there is a nice way. If you plan
for thousands of boards, it may be worth having a look at. You drill
holes, put copper plugs in, and deform them slightly with a pressure
tool. If your are interested, I can ask the inventor for permission to
send information I have.  But, as I said, it's for real mass production.
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Bloomquist, Ken
Skickat: den 5 april 2007 17:43
Till: [log in to unmask]
Ämne: [TN] Thermal via's on D2PAK

Do any of you see an issue with putting thermal via's under the bodies
of a D2PAK? Do you have any recommendations for the number or size or
the via's to help transfer heat to the other side of the board?

Thanks,

KennyB

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