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| Date: | Tue, 10 Apr 2007 09:40:19 +0300 |
| Content-Type: | text/plain |
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Before even trying to rely on the water break test, I suggest you may
care to read the peer-reviewed paper I presented in Circuit World,
Volume 35, Number 4, 2005. pp 47-50, entitled "The Water Break Test".
This will explain that there are a number of fallacies involved, when
relying on such empirical methods. The main one is that the test will
succeed only on contaminated surfaces.
Brian
Marsico, James wrote:
> Hello Technet:
>
>
>
> We have an application where we have to etch a PTFE PWB in preparation
> for bonding. The etch is a commercially available sodium-containing
> solution. We're also expected to meet a water-break test prior to
> bonding. We're having trouble meeting the water-break test and was
> wondering if the two (etched PWB and water-break) are compatible. If
> so, what cleaning/rinsing could be performed after the etching to ensure
> a water-break free surface?
>
>
>
> Thanks in advance,
>
>
>
> Jim Marsico
>
> EDO Corporation
>
> Amityville: 631-630-5079
>
> Bohemia: 631-218-7057
>
> [log in to unmask]
>
>
>
>
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