Both of you,
This was a TN record! I got an answer 3 minutes after depressing
'enter'! I will call Guiness Book of Records.
Fortunately, our boards are reinforced by means of a aluminum structure
with built-in air channels for forced air cooling. But I'm doing a job
for another company, and that board is like a big membrane (10 by 20
inches, few supports)
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Tempea, Ioan
Skickat: den 16 april 2007 19:00
Till: [log in to unmask]
Ämne: Re: [TN] Placement of large flatpacks and BGAs close to board edge
Inge,
I knew it the other way aroung, never place them in the center, because
normally this is where the warpage radius reaches its max.
Who's right, please? Anybody?
Thanks,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Hfjord
Sent: Monday, April 16, 2007 12:54 PM
To: [log in to unmask]
Subject: [TN] Placement of large flatpacks and BGAs close to board edge
Dear collegues,
I have heard of a thumb rule, never place them along and close to the
edge. Hence, we place them (when suitable) in the center. I have
forgotten why this rule. Was it because of vibration nodes, warpage
during soldering, tempcycle issues or what? Is there a IPC standard or
other reference?
Inge
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