Werner,
The reference for the first paper:

M. Cole, M. Kelly, M. Interrante, G. Martin, C. Bergeron, M. Farooq, M. 
Hoffmeyer, S. Bagheri, P. Snugovsky, Z. Bagheri, M. Romansky, (IBM and 
Celestica), ?Reliability Study and Solder Joint Microstructure of Various 
SnAgCu Ceramic Ball Grid Array (CBGA) Geometries and Alloys, 
SMTA-International, 9/06, Chicago, pp 283-292.

or

M. Cole, M. Kelly, M. Interrante, G. Martin, C. Bergeron, M. Farooq, M. 
Hoffmeyer, S. Bagheri, P. Snugovsky, Z. Bagheri, M. Romansky, (IBM and 
Celestica), ?Reliability Study and Solder Joint Microstructure of Various 
SnAgCu Ceramic Ball Grid Array (CBGA) Geometries and Alloys, Journal of 
Surface Mount Technology, Oct 2006, Vol. 19, Issue 4, pp 18-27.

Let me know if you'd like me to email you the paper.
Regards,
Marie


Marie S. Cole
Senior Technical Staff Member, Lead Free Program Mgr
Interconnect Technology Procurement
IBM Integrated Supply Chain
MS/87P, 2070 Rt 52
Hopewell Jct, NY 12533
(845)-894-8069  (845)-892-6628 (fax) 8-533-8069 (tie-line)
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