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Subject:	17th Shanghai International SMT High-Level Conference, 24-26 April 2007
From:	Tina Nerad <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Mon, 16 Apr 2007 15:16:50 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

Lead Free Manufacture Conference & Workshops
17th Shanghai International SMT High-Level Conference
April 24-26, 2007
Shanghai Ever Bright International Hotel - Shanghai, China
IPC - Association Connecting Electronics Industries announces the Lead
Free Manufacture Conference and Workshops April 24-25, to be held in
conjunction with the Beijing SMT and CBC 17th Shanghai International SMT
High Level Conference April 24-26, 2007 during NEPCON Shanghai.  Take
this chance to 
hear from experts on lead free manufacture.

Our in-depth workshops include:

24 April 2007
Achieving High Reliability for Lead Free Solder Joints - Materials
Consideration
Ning-Cheng Lee, Ph.D., of Indium Corp. of America

25 April 2007
Is Your Information About CAF\SIR\ECM Authoritative? Effective?
Bob Neves, of Microtek Laboratories

On April 26 2007 join us for the technical conference featuring
prominent speakers presenting in-depth lectures on:
- A Compliant and Creep Resistant SAC-A(Ni) Alloy
- A Feasibility Study of 01005 Chip Components in a Lead Free System,
Micovia Filling and PTH: Technology Options and Solutions
- Micovia Filling and PTH: Technology Options and Solutions
- Industrial Confusion Caused by a Scientifically Unsound Term
"Halogen-Free" 
- Study of Planar Microvoiding in Pb Free Solder Joints

For more information, please cut and paste www.ipc.org/LFShanghai07 to
download the registration form.

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