Sender: |
|
X-To: |
|
Date: |
Tue, 3 Apr 2007 06:45:42 -0400 |
Reply-To: |
|
Content-Transfer-Encoding: |
7bit |
Subject: |
|
From: |
|
Content-Type: |
text/plain; charset="US-ASCII" |
In-Reply-To: |
|
Organization: |
R&D Assembly |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
As a test?
Destructive, I would print paste and reflow without parts, and evaluate
results.
If I really need the board for production, I would dispense paste on the BGA
land pattern, reflow, evaluate, then if the board proved solderable, remove
solder - gently - from the BGA land pattern, print paste parts and reflow.
It is possible that a marginal board would be degraded by the test and your
second reflow on the unsoldered pads would not be as nice as the test, but
the BGA should be good.
****************************************
New address & phone numbers below
Guy Ramsey
R&D Assembly
1660 East Race Street
Allentown PA 18109-9580
(610) 443-2299
FAX (610) 443-1622
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Olsen
Sent: Monday, April 02, 2007 8:00 PM
To: [log in to unmask]
Subject: [TN] Immersion Tin Wetting
Hello,
Immersion tin on a bare board.
If wet ability under a BGA is in question should you reflow the tin in oil
prior to assembly?
Would this help or no.
Thank you
Rich Olsen
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|