Dear Technetters,
I have a Film Chip Capacitor with a PET-HT dielectric that's used on a lead-free assembly. Well, the limitations on the cap are 240 C max with time above 217 at less than 60 seconds. Is anybody else dealing with such components and if yes, how r they tailoring their reflow profiles to handle these parts and still get good solderability across the board. I am getting insufficient (as per IPC) fillet across that component. The rest of the board solders fine....... The temperature is okay (I am aiming for 238 C peak and 58 seconds TAL) but the TAL is what I have an issue with. Any particular profile working better? Any special tweaks that ppl are using?
Thanks,
Amol
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE
Sent: Monday, April 02, 2007 12:34 PM
To: [log in to unmask]
Subject: Re: [TN] Sn-2Cu plating solderability question
Joe, what allow on leads are we talking about? Is it 99.3Sn/0.7Cu? Why
this lead-free alloy and not say SAC305?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Monday, April 02, 2007 12:01 PM
To: [log in to unmask]
Subject: [TN] Sn-2Cu plating solderability question
Good Morning All.
Our inductor supplier, TOKO informed us via PCN that they switched to a
Pb-free, termination plating consisting of Sn-2Cu, which I am not
familiar with. I am looking for some info on this alloy's reflow
requirements as well as compatibility with SnPb solder paste, which is
what we use.
Thanks again
-Joe
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