You can save an additional 10% off of current registration prices, if
you register by March 9th!

IPC and JEDEC will host a Global Conference on April 10-12, 2007, in
Boston.  Register by March 9, 2007, and save an additional 10% off the
current registration prices! We are also offering group discounts for
companies that want to send more than one employee to this event.

Top experts from around the world will present topics on the following:
Via Reliability - A Holistic Process Approach, Quality and Reliability
of Through-Hole Mount (THM) Assembly with Lead Free Minipot Rework,
Strain Range Approximation for Estimating Fatigue Life of Lead Free
Solder Interconnects Under Temperature Cycle Loading, Application of
Advanced FMEA Techniques to Surface Mount Lead Free Soldering Process: A
Comprehensive Map Which Avoids Common Problems, and Accelerated Life
Testing of SN100C for Surface Mount Devices: Vibration.

Course topics will include:  Crafting of a Lead Free Solder Process, How
to Specify PCBs for Lead Free Assembly, Lead Free Reliability for Harsh
Environment Electronics, Understanding of J-STD-020B and 033A
Classification and Handling of Moisture-Sensitive ICs. 

For more information about this conference and to register, please cut
and paste www.ipc.org/LFReliability into your browser to download the
conference brochure and registration form.  To reserve your room, please
contact the Courtyard Boston Tremont Hotel directly at 617-426-1400 and
ask for the IPC/JEDEC Lead Free Conference rate of $159 (single/double)
per night. 
 

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