Please share the photos at your convenience,

Paymon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: March 30, 2007 7:23 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Resist Encroachment onto BGA pads

Hi Paymon,
It is not that the IPC does "not allow" it, but data have shown that the

stress concentrations in the solder ball geometries resulting from
SMD-[soldr mask 
defind] pads is about a factor of 2 to 3 less than well-shaped balls on
pads 
not encroached by solder mask. I can show you some beautiful [to an
engineer, 
anyway] pictures of the consequences.

Werner



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