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March 2007

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 30 Mar 2007 17:19:32 -0400
Content-Type:
text/plain
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text/plain (191 lines)
Yes I understand - where the conductor joins you are allow .002" and
.001" as stated in f.


Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 

-----Original Message-----
From: Paymon Sani [mailto:[log in to unmask]] 
Sent: Friday, March 30, 2007 3:24 PM
To: TechNet E-Mail Forum; Jeffrey Bush
Subject: RE: [TN] Solder Resist Encroachment onto BGA pads

Hi Jeffry, the criteria that you mentioned below applies to fine pitch
components but not BGAs. In 6012B, the next paragraph just below it
suggests no solder resist encroachment for the NSMD BGA pads. The same
is also said in IPC-600A.

I followed up with the links that Steve provided. In conclusion, the
solder resist is not allowed to encroach on NSMD, BGA pads for 2
reasons:
1- It reduces the product reliability because it creates high stress
points, therefore cracking of the solder joint.
2- The BGA solder joint stresses are balanced between the component and
the PCB; this is achieved by selecting the correct pad dimension. The
encroaching solder resist disturbs the PCB pad geometry causing more
stresses on the solder joint to the PCB.

Cheers,
Paymon Sani



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeffrey Bush
Sent: March 30, 2007 1:45 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Resist Encroachment onto BGA pads

IPC-6012 allows .002" for 50 mil or greater pitch and .001" for <50 mil
pitch.  3.7.1.f.1

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ian Hanna
Sent: Friday, March 30, 2007 12:26 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Resist Encroachment onto BGA pads

600A 2.9.3.2 "BGA --Copper Defined Lands  -- Class I/II/III Acceptable
== 'soldermask does not encroach on the land, except at the conductor
attachment' -- Nonconforming == does not meet...


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Friday, March 30, 2007 11:16 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Resist Encroachment onto BGA pads

Where does it say that it is not allowed? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Friday, March 30, 2007 11:02 AM
To: [log in to unmask]
Subject: [TN] Solder Resist Encroachment onto BGA pads

Hello All,

 

Does anybody know why IPC does not allow any solder resist encroachment
onto the BGA copper defined lands for PCBs?


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recipient, please be aware that any dissemination, distribution or
copying of this communication is strictly prohibited.  If you have
received this in error, please notify the sender by telephone at
604.430.4336 or by return e-mail, and please delete or destroy all
copies of this communication.  Thank you!

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