Also reduces surface energy to the point that conformal coating materials
can struggle to achieve good adhesion.  

Best Regards,

Phil.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barmuta, Michael
Sent: 30 March 2007 22:03
To: [log in to unmask]
Subject: Re: [TN] UV Bump

Hi John: The short answer is yes, a UV bump can eliminate white hazing.
However there are many causes of white hazing or residue. Look into the
TechNet archives for more info on this.

A UV bump is used on photoimageable soldernmasks in conjunction with a
thermal bake. The bare board typically runs thru a high energy (200+
watt/in) output UV lamp bank in a conveyorized oven. This aids in
further polymerization or crosslinking of photoreactive components along
with the other constituents in the soldermask. Making it less
susceptible to chemical attack and interactions during assembly
processes such as wavesolder/flux and wash. 


	
Regards
	
Michael Barmuta
	
Staff Engineer
	
Fluke Corp.
	
Everett WA
	
425-446-6076



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons
Sent: Friday, March 30, 2007 1:13 PM
To: [log in to unmask]
Subject: [TN] UV Bump

Happy Friday!

 

I am having a conversation with an industry peer and the conversation
has
led to the following question;

 

"I am not aware of any other ionic cleanliness specs for this board. The
reason our customer is looking for UV bump is that they feel that during
assembly UV bumped boards would not experience white hazing issues. They
are
having some issues with their assembly house in regard to white hazing.
Is
UV bumping a solution to problems with white hazing that occur during
the
wave soldering process?"

 

I don't have an answer for her.  Can anyone provide me with some insight
here?

 

Regards

John Parsons

 


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