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March 2007

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
Date:
Fri, 30 Mar 2007 15:45:27 -0500
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I've seen some hazing due to moisture, have baked those boards and been able
to remove the hazing affect. We never lost adhesion are you seeing any
adhesion loss?

Kat

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons
Sent: Friday, March 30, 2007 3:13 PM
To: [log in to unmask]
Subject: [TN] UV Bump

Happy Friday!

 

I am having a conversation with an industry peer and the conversation has
led to the following question;

 

"I am not aware of any other ionic cleanliness specs for this board. The
reason our customer is looking for UV bump is that they feel that during
assembly UV bumped boards would not experience white hazing issues. They are
having some issues with their assembly house in regard to white hazing. Is
UV bumping a solution to problems with white hazing that occur during the
wave soldering process?"

 

I don't have an answer for her.  Can anyone provide me with some insight
here?

 

Regards

John Parsons

 


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