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March 2007

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Subject:
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gabriela Bogdan <[log in to unmask]>
Date:
Fri, 30 Mar 2007 13:45:54 +0200
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Our company requires change of manufacturer's catalog number , it will be a 
lot of work...
----- Original Message ----- 
From: "arnaud grivon" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 30, 2007 1:29 PM
Subject: Re: [TN] Alternative SAC


> Gabriela,
>
> I have exactly the same concern as you.
> Low silver SAC alloy like SAC 105 or SAC 206 (with possible addition of 
> Ni) are promoted by some component manufacturers for devices typically 
> found in handheld applications. Be aware that these alloys have higher 
> melting temperatures close to the 232°C reflow temperature of pure tin. 
> Fortunately, it looks like this alloy family is only considered for small 
> packages (e.g. 0.8mm and 0.5mm pitch packages) which is a good point from 
> a thermal profiling point of view.
> Very interested to follow that thread....
> Best regards,
>
> A. Grivon
>
> Gabriela Bogdan a écrit :
>> Dear Technetters:
>> Do you know if SnAg1Cu0.5 alloy is being used by BGA manufacturers 
>> instead of SAC 305?
>> If so, what impact does it have on the mixed assembly solder profiles?
>> We use a peak temperature of 232C on the lead free BGA top, for lead free 
>> BGA's on leaded solder paste on mixed assemblies.
>> Is the information usually available on the data sheets?
>> (Yesterday....)
>> Gaby
>>
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