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March 2007

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Subject:
From:
arnaud grivon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, arnaud grivon <[log in to unmask]>
Date:
Fri, 30 Mar 2007 13:29:53 +0200
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Gabriela,

I have exactly the same concern as you.
Low silver SAC alloy like SAC 105 or SAC 206 (with possible addition of 
Ni) are promoted by some component manufacturers for devices typically 
found in handheld applications. Be aware that these alloys have higher 
melting temperatures close to the 232°C reflow temperature of pure tin. 
Fortunately, it looks like this alloy family is only considered for 
small packages (e.g. 0.8mm and 0.5mm pitch packages) which is a good 
point from a thermal profiling point of view.
Very interested to follow that thread....
Best regards,

A. Grivon

Gabriela Bogdan a écrit :
> Dear Technetters:
> Do you know if SnAg1Cu0.5 alloy is being used by BGA manufacturers instead of SAC 305?
> If so, what impact does it have on the mixed assembly solder profiles?
> We use a peak temperature of 232C on the lead free BGA top, for lead free BGA's on leaded solder paste on mixed assemblies.
> Is the information usually available on the data sheets?
> (Yesterday....)
> Gaby
>
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