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March 2007

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Subject:
Alternative SAC
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gabriela Bogdan <[log in to unmask]>
Date:
Fri, 30 Mar 2007 13:17:48 +0200
Content-Type:
text/plain
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text/plain (18 lines) 
Dear Technetters:
Do you know if SnAg1Cu0.5 alloy is being used by BGA manufacturers instead of SAC 305?
If so, what impact does it have on the mixed assembly solder profiles?
We use a peak temperature of 232C on the lead free BGA top, for lead free BGA's on leaded solder paste on mixed assemblies.
Is the information usually available on the data sheets?
(Yesterday....)
Gaby

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