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March 2007

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Subject:
From:
Ian Hanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ian Hanna <[log in to unmask]>
Date:
Thu, 29 Mar 2007 12:42:52 -0400
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IPC 6012B 3.11.1 is 'Circuit Repairs' not outgassing...

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE
Sent: Thursday, March 29, 2007 11:02 AM
To: [log in to unmask]
Subject: Re: [TN] IPC 6012 : Outgassing Criteria

Outgassing is a concern for Space missions. NASA requires that the
outgassing meet two requirements,TML Total Mass Loss and CVCM,
Collectible Volatile Condensible Material. The TML limit is 1.0% and the
CVCM limit is 0.1%. The reason this is important is that in vacumm, the
volatiles that are forced out om materials may condense onto critical
items such as optics and make them unuseable. Certain conformal coatings
may out gas tremendously. NASA tests materials for outgassing and
maintains an outgassing data bank of outgassing numbers with test
reports for all materials tested. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lum Wee Mei
Sent: Wednesday, March 28, 2007 11:17 PM
To: [log in to unmask]
Subject: [TN] IPC 6012 : Outgassing Criteria

Hello,
 
I was reading this IPC 6012 when I come across Section 3.11.1 Outgassing
 
1. What actually is outgassing?
2. Why is outgassing critical for PCB?
3. As the PCB consist of so many processes and different materials go
into making it, where did the outgassing come from? 4. Is the criteria
mandatory for all Class PCB or only specified application?
5. If for only specific application, which application and why?
6. Come to think about it, can the outgassing come also from the coating
we use to seal the assembly?
 
Hope someone out there can share with me (novice) on this issue.
 
Thanks and regards,
Wee Mei

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