Straight forward board to build with folks experienced in hybrid builds.


Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pasquito, Helena
Sent: Thursday, March 29, 2007 10:11 AM
To: [log in to unmask]
Subject: Re: [TN] Via aspect ratio in mixed dielectric PCB's

Hello Werner,

1.  Board is hybrid construct .083" thick  +/- .007"
2. Top .030" is Taconics  RF-35-0300-C1/C1; an RF/microwave woven
laminate
3. Remaining .053" is combination of FR406 Cores and prepregs.
4. Vias are drilled at .014" thru the full stack-up and are specd to be
plated with .001" min Cu.
    Vias and outer surfaces are to be finished with 3-10uin Au over
150-200uin Ni.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, March 28, 2007 5:00 PM
To: [log in to unmask]
Subject: Re: [TN] Via aspect ratio in mixed dielectric PCB's

Hi Helena,
You do not explain what "Taconics material" is and what its properties
are.
Just generally speaking, if you have an asymmetric lay-up, you are prone
to 
PCB warpage, particularly with LF-soldering T's.

Werner



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