Hello,
 
I was reading this IPC 6012 when I come across Section 3.11.1 Outgassing
 
1. What actually is outgassing?
2. Why is outgassing critical for PCB?
3. As the PCB consist of so many processes and different materials go into making it, where did the outgassing come from? 4. Is the criteria mandatory for all Class PCB or only specified application?
5. If for only specific application, which application and why?
6. Come to think about it, can the outgassing come also from the coating we use to seal the assembly?
 
Hope someone out there can share with me (novice) on this issue.
 
Thanks and regards,
Wee Mei

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------