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March 2007

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Wed, 28 Mar 2007 15:26:09 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (102 lines)
	Badri:
	Is there a mistake and it really is NiPdAu?  Nickel Palladium
Gold
	Ramon
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of BADRI
Sent: Wednesday, March 28, 2007 10:07 AM
To: [log in to unmask]
Subject: [TN] COMPATIBILITY

Hello all,

 

1.	Process: lead free (SAC 305) solder paste
2.	fine pitch component (QFP)termination finish: SN /NI/Pd/CU
3.	PCB pads: ENIG

 

Requesting every one to comment on the above combination. Will I have
any major issues post reflow.?

 

 

Thanx

Badri

 

 

 








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