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March 2007

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Subject:
From:
Michelle Michelotti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michelle Michelotti <[log in to unmask]>
Date:
Tue, 27 Mar 2007 09:10:34 -0500
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Lead Free Selective Soldering - The Future is Now

April 17, 2007 - Bannockburn, IL

 

This IPC workshop will provide case histories and examples where
selective soldering has been implemented. To complete your knowledge of
the selective soldering process, it will also describe component
limitations, clearance restrictions, and thermal requirements and solder
joint reliability issues.

 

Some of the topics that will be covered are:  what selective soldering
is, technology drivers, the benefits of selective soldering, selective
soldering methods, and advantages and disadvantages of various methods.
It will also review design guidelines, selecting the right system for an
application, case histories, increasing role of selective soldering and
future trends

 

Bob Klenke is the workshop instructor.  He is a mechanical engineer with
over 25 years of experience in the electronics assembly industry,
particularly in selective soldering. Bob is a principal consultant of
ITM Consulting, an international consulting firm. Klenke is also
president and founder of RHK Associates. 

 

To register for this workshop, please cut and paste www.ipc.org/LFS0407
into your browser and download the registration form.

 

 

Lead Free SMT Manufacturing and Troubleshooting 

April 18, 2007 - Bannockburn, IL 

 

While other courses and workshops discuss aspects of lead free alloys,
this course examines what lead free means to the electronic assembler at
the process and logistics level. This course will give the participant
an in-depth understanding of SMT assembly using lead free solder alloys.
The various aspects of no-lead solder are examined, including why the
drive for lead free electronic manufacturing, as well as which lead free
alloys are being considered, and by whom. The pros and cons of candidate
solder alloys are discussed and put into an applications-specific
perspective. 

The second part of the course will contend with the implications of lead
free on the SMT assembly process. Interactions with substrate finishes
and components will be discussed as will the far-reaching implications
and process adaptations that must be made to accommodate no-lead
soldering. 

 

You will review the following:  why lead is a concern in electronics,
status of lead free in the world, lead free alloy directions,
wave-solder alloys, impact of no lead on SMT assembly, OEM vs. CEM
impacts, alternatives and enhancements to lead free electronic assembly
and finally, casual mini-audit (review of current assembly facility, if
applicable).

 

This workshop instructor is Phil Zarrow, President and co-founder of
ITM, Incorporated. He has been involved with hybrid and PCB assembly for
more than 26 years, has chaired and instructed at numerous seminars and
conferences and has been involved with setup and troubleshooting
through-hole and SMT processes throughout the world. 

 

To register for this workshop, please cut and paste
www.ipc.org/LFSMT0407  into your browser and download the registration
form.


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