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March 2007

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Sun, 25 Mar 2007 19:18:05 +0530
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Dear All,

We have manufacturing small volumes of Flex rigid boards. We have a small issue wrt the routing of the rigid portion of the circuit. We end up having a little portion of the rigid epoxy / polyimide projecting on the flex portion and the finish at these edges are not good enough. Can somebody give some inputs on the process flow which will help us in improving this aspect

Rgds

Pradeep

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Micropack Ltd, Bangalore, India


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