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March 2007

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Thu, 22 Mar 2007 08:04:57 +0100
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Yes, please, if not taking too much of your flight time.

(Thanks for trike pictures. What if Leonardo had seen that? "YES! YES! I
knew it would work! " There is a small club nearby, just about 10
members, I hear them long before they appear in the sky. Sounds like
midgets. How far can you go on normal fuel tank?)

Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Creswick, Steven
Sent: den 21 mars 2007 12:16
To: [log in to unmask]
Subject: Re: [TN] AlSiC

Ingemar,

It would seem that the SiC matrix should have been fully infiltrated
with the molten Al.  Maybe you did not expect the blisters to be from
gas entrapment...  What do you believe the source of the blistering to
be?

There was a time when someone was taking the AlSiC 'slug' and placing
that inside an aluminum casting - which could later be milled down, but
still leaving aluminum over the AlSiC slug.

From there plating was a snap.

Want me to dig out who it was that did it?

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, March 20, 2007 3:39 PM
To: [log in to unmask]
Subject: [TN] AlSiC

Honoured  Messieurs wet chemists,

have to make solderable finish on AlSiC substrates. Got copper plated
samples from manufacturer. We did usual 300 Centigrade blister test, and
as expected, large blisters were created. Now, what suitable finish do
you recommend? Would like to try nickel sputter+electrolytic nickel+gold
flash, but there may be wet chemistry for the adhesion layer instead of
sputtering or thermal spray.  There are tin plating methods too, but
they seem not to be for soldering , but rather act as environment
protection coatings.

Inge 

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