Hi

I am working on a new board with a 0.5mm pitch BGA and I am wonder if
someone can advise me on the footprint.

1) the datasheet says the solder ball is 0.3mm +/-0.05mm
2) IPC recommends to use 80% of ball diameter for the pad which would be
0.24mm
3) Would it be OK to use a 0.2mm pad? I am hesitant to go against
recommended 
size without some corroborating documentation. The reason I would want to
use 0.2mm pad is to avoid using via-in-pad.

I am curious if IPC defines footprints based on what is good for
manufacturing or is it simply theoretical?

Thanks
Bob 

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