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Subject:	Re: Solderability problems on through holes only.
From:	R Sedlak <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:	Wed, 21 Mar 2007 13:28:47 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (84 lines)

I would suspect quality of gold plate. If the gold plate was light, and therefore porous, the Nickel under the gold might oxidize during the SMT, and become unsolderable?

Rudy Sedlak
RD Chemical Company

Peter Wong <[log in to unmask]> wrote: Hi Technetters,

We are having a solderability problem confined to only through hole
locations where we need some help or advice.

We are soldering a no-clean SAC305 alloy to an ENIG finished board. All
SMT solder joints (both sides) are fine. During hand soldering in our
dedicated lead free area, we are having problems with solder wetting to
some of the annular rings and barrels of through hole locations, not all
holes. The assembly is an 0.062" thick 4 layer 1"x1" board so it is not
thermally challenging.

We've built thousands of these in the past without this particular
problem.

The time lag between smt and through hole assembly is 1-2 days.

We've tried using a more aggressive flux such as OA flux with no
improvement.

The only way that we can get solder to wet is to mechanically scrape the
annular rings with a pick.

Has anyone seen this before? Why would this only occur on some of the
through hole locations and not on smt pads?

We have isolated this to a specific lot code of boards and are waiting
for some advice from our board vendor as well.

Thanks

Peter

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