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March 2007

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 21 Mar 2007 07:50:08 -0400
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text/plain
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text/plain (97 lines)
Typical PCB fab defect.  Likely resist left on pad (chip or redeposit)
or it could be a scratch to the tin resist allowing the basis copper to
etch out.    

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of West, Jim
Sent: Tuesday, March 20, 2007 10:07 AM
To: [log in to unmask]
Subject: [TN] Pad damage

Hi everyone,
 
Take a look at the link
http://stevezeva.homestead.com/files/Pad_Damaged.jpg
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg> 
 
Tell me what you think about the pad damage shown.  I have not come
across anything like this before, and was asked by our group leader if
this was acceptable.  My initial thought was this is not acceptable and
we should reject the board.  As always, I wanted to point out the IPC
section that would explain why this is not good.  However, I could not
come across anything except for section 10.2.9 (Laminate
conditions-conductors/lands).  I know there is probably a section I am
overlooking?  
 
There is still a high percentage of the pad intact and no evidence of
lifting.  Is this something common that others have seen?  If so, what
do I tell the board house to look out for to prevent something like this
in the future? 
 
Would anyone accept this?
 
 
 
Thanks,  
 
 
 
 
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>
 


Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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