Ingemar,

It would seem that the SiC matrix should have been fully infiltrated
with the molten Al.  Maybe you did not expect the blisters to be from
gas entrapment...  What do you believe the source of the blistering to
be?

There was a time when someone was taking the AlSiC 'slug' and placing
that inside an aluminum casting - which could later be milled down, but
still leaving aluminum over the AlSiC slug.

From there plating was a snap.

Want me to dig out who it was that did it?

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, March 20, 2007 3:39 PM
To: [log in to unmask]
Subject: [TN] AlSiC

Honoured  Messieurs wet chemists,

have to make solderable finish on AlSiC substrates. Got copper plated 
samples from manufacturer. We did usual 300 Centigrade blister test, and
as 
expected, large blisters were created. Now, what suitable finish do you 
recommend? Would like to try nickel sputter+electrolytic nickel+gold
flash, 
but there may be wet chemistry for the adhesion layer instead of
sputtering 
or thermal spray.  There are tin plating methods too, but they seem not
to 
be for soldering , but rather act as environment protection coatings.

Inge 

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