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March 2007

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Subject:
From:
Tony Steinke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tony Steinke <[log in to unmask]>
Date:
Tue, 20 Mar 2007 16:23:39 -0500
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Paymon,
What chemistry are using. Check your bath(catalyst)temperature. Also you can
cut back on dwell time in catalyst. You may be beyond bath life of the
catalyst.




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Tuesday, March 20, 2007 11:23 AM
To: [log in to unmask]
Subject: [TN] Nickel Foot

Hello All,

 

I have noticed a trend with our ENIG PCBs where Nickel is growing beyond
the Copper and onto the FR4 and Soldermask. I would like to know:

*	Is it a cause for concern with our assembly process?
*	Is it a cause for concern for the end user?
*	How is it caused?
*	How could it be prevented?

 

If you know the answers to any of the above I would appreciate your
feedback.

 

Cheers,

Paymon

 

 

 

 

 

 


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