Honoured  Messieurs wet chemists,

have to make solderable finish on AlSiC substrates. Got copper plated 
samples from manufacturer. We did usual 300 Centigrade blister test, and as 
expected, large blisters were created. Now, what suitable finish do you 
recommend? Would like to try nickel sputter+electrolytic nickel+gold flash, 
but there may be wet chemistry for the adhesion layer instead of sputtering 
or thermal spray.  There are tin plating methods too, but they seem not to 
be for soldering , but rather act as environment protection coatings.

Inge 

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