Jim,
As a bare circuit board this condition, obviously the board is
unacceptable.
In looking at the pictures, it is evident that you have components and
labor invested into this assembly. The picture does not do justice to what
the rest of the assembly looks like, where it is used, customer
expectations, quality requirements, etc etc.
So then the answer becomes, it depends.
There are a million scenarios where a case could be made to use the board.
There would also be an equal number of scenarios where you should not use
the board.
The bottom line is to tell your board mfr about this condition, get an
explanation how this board left their facility, decide if you need to
increase your incoming inspection and just move on
"West, Jim" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/20/2007 10:06 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"West, Jim" <[log in to unmask]>
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Subject
[TN] Pad damage
Hi everyone,
Take a look at the link
http://stevezeva.homestead.com/files/Pad_Damaged.jpg
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>
Tell me what you think about the pad damage shown. I have not come
across anything like this before, and was asked by our group leader if
this was acceptable. My initial thought was this is not acceptable and
we should reject the board. As always, I wanted to point out the IPC
section that would explain why this is not good. However, I could not
come across anything except for section 10.2.9 (Laminate
conditions-conductors/lands). I know there is probably a section I am
overlooking?
There is still a high percentage of the pad intact and no evidence of
lifting. Is this something common that others have seen? If so, what
do I tell the board house to look out for to prevent something like this
in the future?
Would anyone accept this?
Thanks,
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>
Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979
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