I have seen a similar but not exactly the same type of problem with boards
before, although it was more puzzling... because it was random and not
repeatable from board to board... Different areas of the board were getting
breaks in the lines near pads and even across pads...
It turns out that the mask used to plate the tin resist before etching was
breaking loose in the plating solution and re-depositing itself in random
places on the board surface preventing tin plating on the copper and causing
the traces or pads to not be fully protected by the tin during the etching
process... leaving voids much like you show in the picture.
Bill Brooks
PCB Design Engineer, C.I.D.+
Tel: (760)597-1500 Fax: (760)597-1510
Datron World Communications, Inc.
Vista, California
-----Original Message-----
From: Garry Foskett [mailto:[log in to unmask]]
Sent: Tuesday, March 20, 2007 6:24 AM
To: [log in to unmask]
Subject: Re: [TN] Pad damage
Jim,
I would inspect the manufacturing files foe this feature on the pad.
From the look of it this is not what was on the manufacturing data and thus
an error from the supplier.
The reason fro this thought is that the resist window looks to be the
correct size and shape for a complete rectangular pad.
Garry
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jones, Evamaria
Sent: 20 March 2007 14:11
To: [log in to unmask]
Subject: Re: [TN] Pad damage
Does it meet the drawing? If not it is a defect.
Evamaria Jones
Quality Assurance Specialist
Electronic Manufacturing Skills Instructor
General Dynamics Information Technology
(703) 874-6796 direct
(540) 522-8823 cell
[log in to unmask]
www.gdit.com
<https://owandhm.gd-ns.com/exchweb/bin/redir.asp?URL=http://www.gdit.com/>
________________________________
From: TechNet on behalf of West, Jim
Sent: Tue 3/20/2007 10:07 AM
To: [log in to unmask]
Subject: [TN] Pad damage
Hi everyone,
Take a look at the link
http://stevezeva.homestead.com/files/Pad_Damaged.jpg
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>
Tell me what you think about the pad damage shown. I have not come
across anything like this before, and was asked by our group leader if
this was acceptable. My initial thought was this is not acceptable and
we should reject the board. As always, I wanted to point out the IPC
section that would explain why this is not good. However, I could not
come across anything except for section 10.2.9 (Laminate
conditions-conductors/lands). I know there is probably a section I am
overlooking?
There is still a high percentage of the pad intact and no evidence of
lifting. Is this something common that others have seen? If so, what
do I tell the board house to look out for to prevent something like this
in the future?
Would anyone accept this?
Thanks,
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>
Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979
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