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March 2007

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Subject:
From:
Fran Juliot <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Fran Juliot <[log in to unmask]>
Date:
Tue, 20 Mar 2007 09:50:07 -0500
Content-Type:
text/plain
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text/plain (90 lines)
Jim,
As a Quality Mgr if I saw something like this I would scrap it.  I would
think that this is not the kind of Quality your board supplier wants leaving
thier facility.  It least it wouldn't leave mine.  Your board supplier
should not have an issue with this being rejected.  You should not have to
give a clause from IPC when it plain and simply is poor workmanship.
Fran Juliot
Circuit Science

----- Original Message -----
From: "West, Jim" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, March 20, 2007 9:07 AM
Subject: [TN] Pad damage


Hi everyone,

Take a look at the link
http://stevezeva.homestead.com/files/Pad_Damaged.jpg
<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>

Tell me what you think about the pad damage shown.  I have not come
across anything like this before, and was asked by our group leader if
this was acceptable.  My initial thought was this is not acceptable and
we should reject the board.  As always, I wanted to point out the IPC
section that would explain why this is not good.  However, I could not
come across anything except for section 10.2.9 (Laminate
conditions-conductors/lands).  I know there is probably a section I am
overlooking?

There is still a high percentage of the pad intact and no evidence of
lifting.  Is this something common that others have seen?  If so, what
do I tell the board house to look out for to prevent something like this
in the future?

Would anyone accept this?



Thanks,




<http://stevezeva.homestead.com/files/Pad_Damaged.jpg>



Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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