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March 2007

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Subject:
SMT Solder Joint Strength
From:
"Gregg A. Owens" <[log in to unmask]>
Reply To:
Gregg A. Owens
Date:
Fri, 16 Mar 2007 11:05:25 -0700
Content-Type:
text/plain
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text/plain (25 lines) 
Dear Technetters:

Again I have a student asking a good question for which I don't have a reply.

What IPC standard(s) or test method or methodology does one apply to test or evaluate the strength
of a SMT solder joint adherence to the land (such as a chip or gull wing). 

Thanks, 

Gregg Owens, MIT
MTTC, Inc.
Mira Loma, CA 91752
 
 

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