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Date: | Thu, 15 Mar 2007 12:48:25 -0400 |
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I have seen this issue of voids due to the black hole process -
excessive outgassing and poor solderability.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of N Burtt
Sent: Thursday, March 15, 2007 1:40 PM
To: [log in to unmask]
Subject: [TN] PCB laminate and immersion silver
Anyone come across an issue when soldering through-hole/mixed tech PCBs
using phenolic cured resin laminates, black hole plating process and
immersion
silver finish? This combination claimed to increase outgassing during
wave
solder (particularly lead-free solder)
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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